Date June 4, 2025 - June 6, 2025
City / Country Tokyo / Japan / Asia
Venue ブラック ジャック アプリ Survey
Items to be exhibited High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, 無料 カジノ ゲーム mounting, OLB/ILB system, COB system, etc.
For Visitors Eligibility : 無料 カジノ ゲーム & general public
Method of admission : Apply/register 無料 カジノ ゲーム
For details, please 無料 カジノ ゲーム the organizer directly.
Organizer JIEP
Message from organizer Held with concurrent exhibitions.
The representative office, person or agency in Japan Tel : +81-3-5931-0039
E-mail :jpcashow@jcs-c.com
Industry
Frequency Annual
last fair information 2024 year
Total number of visitors : 48334
Total number of exhibitors : 438
The past records may include concurrent/joint exhibits.
Official web無料 カジノ ゲーム For more detailed information of the 無料 カジノ ゲーム fair, please checkthe official web無料 カジノ ゲーム External site: a new window will open.of the individual organizer.
last update December 25, 2024

Japanese

Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. 無料 カジノ ゲーム shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.