21 トランプesion & Bonding Expo Osaka

Date May 14, 2025 - May 16, 2025
City / Country Osaka (Osaka) / Japan / Asia
Venue ブラック ジャック アプリ
Items to be exhibited Adhesive Materials, Adhesive Films & Tapes, Joining Equipment & Technologies, Surface Treatment Equipment, Testing/Measurement/Analysis, Design Simulation Tools
For Visitors Eligibility : Trade only
Method of admission : Apply/register online
For details, please contact the organizer directly.
Organizer RX Japan Ltd.
Tel : +81-3-6739-4118
E-mail : mw-j.jp@rxglobal.com
Message from organizer The show gathers advanced adhesive and bonding technologies for automobile, electronics, construction, etc. It is held twice a year in Osaka and Tokyo.
Held with concurrent exhibitions.
Industry
Frequency Annual
last fair information 2024 year
Total number of visitors : 21132
The past records may include concurrent/joint exhibits.
Official website For more detailed information of the trade fair, please check the official website External site: a new window will open. of the individual organizer.
last update November 12, 2024

Japanese

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